| abstract |
A polyimide resin containing a structural unit represented by the following formula (1-1) and a polyimide film containing a structural unit represented by the following formula (1-2) and having a thickness of 10 to 50 μm. (R 1 and R 2 in formula (1-1) are each independently any group of the following formulas (i) to (iv), and in formula (1-2), R 1 and R 2 are Each independently represents a group of the following formula (i) or formula (ii), and * in these formulas is bonded to the carbon marked with * in formula (1-1) and formula (1-2). , ** binds to the carbon marked with ** in formula (1-1) and formula (1-2). Disclosed are a polyimide resin that can form a polyimide film having excellent transparency and a low thermal linear expansion coefficient, and a polyimide film having a lower thermal linear expansion coefficient. |