| abstract |
Provided is a conductive material capable of selectively disposing solder in conductive particles on electrodes and suppressing migration and maintaining low connection resistance even when the electrode width and interelectrode width are narrow To do. The conductive material according to the present invention includes a plurality of conductive particles having solder on the outer surface portion of the conductive portion, a thermosetting compound, and an acid anhydride thermosetting agent, and has a viscosity at 50 ° C. of 10 Pa · s to 200 Pa · s. |