| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83886
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-1152 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01R11-01
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
2016-05-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-06-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2016190244-A1 |
| titleOfInvention |
Conductive material and connection structure |
| abstract |
Provided is a conductive material in which solder in conductive particles can be efficiently disposed on an electrode even when the electrode width is narrow, and conduction reliability can be improved. The conductive material according to the present invention includes a plurality of conductive particles having solder, a thermosetting compound, a thiol curing agent, and an amine curing agent on the outer surface portion of the conductive portion. |
| priorityDate |
2015-05-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |