http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016174705-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N24-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01N30-8679 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D21-18 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D21-18 |
| filingDate | 2015-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2018-02-15-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2016174705-A1 |
| titleOfInvention | Management method of copper sulfate plating solution |
| abstract | As an after-the-fact response, instead of managing the copper sulfate plating solution, which had been renewed and purified by empirical judgment, the aging of the copper sulfate plating solution was objectively judged. Provide technology to manage copper sulfate plating solution. A copper sulfate plating solution for performing copper sulfate plating on a material to be plated, measuring the concentration of impurities in the copper sulfate plating solution, and judging the aging of the copper sulfate plating solution from the concentration of the impurities Management method of copper plating solution. |
| priorityDate | 2015-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 34.