| abstract |
An object is to provide a highly reliable semiconductor device. In order to solve the above-described problems, a semiconductor device according to the present invention includes a heat dissipation substrate, an insulating substrate provided on the heat dissipation substrate and provided with a wiring layer, a plurality of semiconductor elements disposed on the insulating substrate, A conductive block electrically connected to the surface electrode and a terminal electrode are provided, the conductive block has a convex portion, and the convex portion is bonded to the insulating substrate. |