| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C2270-0184
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2439-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-025
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C2205-0323
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2377-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C2203-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C2203-0604
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C2203-0675
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2477-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C2221-012 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B1-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L23-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F17C13-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L23-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F17C1-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 |
| filingDate |
2015-10-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-04-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2016136025-A1 |
| titleOfInvention |
Polyamide resin composition for molded articles that come into contact with high-pressure hydrogen and molded articles using the same |
| abstract |
The melting point of the polyamide 6 resin (A) and the DSC measurement is not higher than the melting point of the polyamide 6 resin (A) + 20 ° C., and the cooling crystallization temperature by the DSC measurement is higher than the cooling crystallization temperature of the polyamide 6 resin (A). A polyamide resin composition comprising a polyamide resin (B) and 0.01 to 5 parts by weight of the polyamide resin (B) with respect to 100 parts by weight of the polyamide 6 resin (A). A polyamide resin composition for molded articles that is exposed to high-pressure hydrogen. Provided is a polyamide resin composition in which generation of defect points is suppressed even after repeated filling and releasing of high-pressure hydrogen, and a molded product having excellent weld characteristics can be obtained. |
| priorityDate |
2015-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |