http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016104530-A1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01F41-04 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01F41-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00 |
filingDate | 2015-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2017-10-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2016104530-A1 |
titleOfInvention | Coil conductor manufacturing method and induction coil provided with coil conductor manufactured using the method |
abstract | An object of the present invention is to provide a coil conductor manufacturing method capable of uniformly increasing the thickness of the conductor and improving the manufacturing efficiency, and an induction coil including the coil conductor manufactured by using the method. . In order to achieve this object, a method for producing a coil conductor by an electrolytic copper plating method, in which an electrolytic copper plating solution includes copper sulfate, sulfuric acid, a cationic surfactant, an organic sulfur compound, and a smoothing agent. A method of manufacturing a coil conductor is used, in which the electrolytic copper plating solution is sprayed onto the surface to be plated at a flow rate of 2 m / min or more and electrolytically deposited to form a coil shape. |
priorityDate | 2014-12-22-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 33.