| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10083
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-10424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03B5-326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-173
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16195
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16315
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-171 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-181
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-564
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-19
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K5-066
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-50
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-057
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1021
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-1071
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H03H9-02937
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0052
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-4817 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H03H9-02 |
| filingDate |
2015-11-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-08-17-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2016084841-A1 |
| titleOfInvention |
Electronic component storage package, multi-cavity wiring board, and method of manufacturing electronic component storage package |
| abstract |
The electronic component storage package of the present invention is formed by surrounding the mounting portion (102) on the upper surface of the insulating substrate (101), and the insulating substrate (101) having the upper surface including the mounting portion (102) of the electronic component (103). A frame-shaped metallized layer (106), and a metal frame (108) joined to the frame-shaped metallized layer (106) by a brazing material (107). ) Includes a first inclined portion (109) inclined inward from the upper surface to the inner peripheral side surface, and a brazing material (107) between the outer periphery of the upper surface of the frame-like metallized layer (106) and the metal frame (108). ) Between the fillet (107a) and the first inclined portion (109) and the metal frame (108), a filler portion (107b) of the brazing material (107) is formed. |
| priorityDate |
2014-11-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |