http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2016075988-A1

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filingDate 2015-08-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-08-03-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2016075988-A1
titleOfInvention Conductor molding method and conductor
abstract Provided are a method for forming a conductor and a conductor that can prevent peeling between a support and a conductive film even when a curved surface portion having a small curvature radius is formed. Only the portion C that becomes the curved surface portion 6 of the laminated body 1 is heated by the heater 5, and while applying a tensile force F to the laminated body 1, the laminated body 1 is placed outside and the conductive film 3 is placed inside. When the curved surface portion 6 is produced by bending, the thickness of the conductive film 3 is B1, the thickness of the adhesive 4 is C1, and the radius of curvature of the inner surface of the conductive film 3 in the curved surface portion 6 is R. The ratio A2 / A1 of the thickness A2 of the support 2 in the curved surface portion 6 to the thickness A1 of the support 2 in the plane portion P is not less than the minimum value (R + B1 / 2) / ((R + B1 + C1 + A2 / 2) × 1.45). And the maximum value (R + B1 / 2) / ((R + B1 + C1 + A2 / 2) × 0.9) or less.
priorityDate 2014-11-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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Total number of triples: 51.