| abstract |
The photosensitive adhesive composition of the present invention is used to join a semiconductor element and a member to be joined, and the elastic modulus at 25 ° C. of the photosensitive adhesive composition after curing is 2.0-3. 5 GPa, the elastic modulus at 25 ° C. of the photosensitive adhesive composition before curing is 70 to 120% of the elastic modulus at 25 ° C. of the photosensitive adhesive composition after curing, and etching. The adhesive force before curing at 25 ° C. of the photosensitive adhesive composition before curing subjected to the treatment and ashing treatment is 20 to 200 N, and 100 to 200 of the photosensitive adhesive composition before curing. The minimum melt viscosity at 20 ° C. is 20 to 500 Pa · s. |