| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-372
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49568
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-06
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L101-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J201-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-372 |
| filingDate |
2015-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-07-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2016052664-A1 |
| titleOfInvention |
Resin composition |
| abstract |
The resin composition of the present invention can maintain an appropriate pot life and maintain the conductivity of the filler. The resin composition of the present invention has excellent adhesive strength. The resin composition of this invention can suppress peeling of the hardened | cured material in a high temperature process. The resin composition of the present invention can be suitably used as a die attach paste or a heat radiating member adhesive. The resin composition contains (A) a filler having a conductive material on the surface of an insulating core material, (B) a thermosetting resin, (C) a curing agent, and (D) a thioether compound. The present invention relates to a die attach paste containing a resin composition or an adhesive for a heat radiating member. The present invention relates to a semiconductor device manufactured using a die attach paste or an adhesive for a heat dissipation member. |
| priorityDate |
2014-10-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |