| abstract |
A temporarily fixing resin composition for forming a temporarily fixing material used in a method for processing a semiconductor wafer, wherein (A) a thermoplastic resin, (B) a thermosetting resin, (C) a (meth) acrylic monomer, And (D) a compound that generates a base and a radical by radiation, the content of the component (D) is 5 parts by mass or more with respect to 100 parts by mass of the component (C), and the semiconductor wafer The processing method includes: a temporary fixing step of temporarily fixing a semiconductor wafer to a support via the temporary fixing material; a processing step of processing the semiconductor wafer temporarily fixed to the support; and the processed semiconductor wafer And a separation step of separating the temporary fixing material from the support and the temporary fixing material, wherein the temporary fixing material is irradiated with radiation in the temporary fixing step. |