| abstract |
The wiring board (1) of the present invention includes an insulating base (11) having a notch (12) that opens on the main surface and side surfaces, and an external circuit provided on the inner surface of the notch (12). The inner surface electrode (13) is connected to the substrate (5a) via the solder (6). The inner surface electrode (13) has nickel and gold on the surface side, and an outer edge portion ( The surface of 13a) has more nickel than gold and the surface of the inner region has more gold than nickel. |