| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-206
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0026
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-429
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-382
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-36
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0313 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 |
| filingDate |
2015-06-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-04-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2015186712-A1 |
| titleOfInvention |
Resin laminate for printed wiring board for forming fine via hole, multilayer printed wiring board having fine via hole in resin insulating layer, and manufacturing method thereof |
| abstract |
A method of processing or manufacturing a printed wiring board capable of forming a via hole with a small difference between the top diameter and the bottom diameter while reducing the top diameter, and a resin laminate used in the method. A resin laminate for a printed wiring board comprising a resin insulation layer for forming fine via holes and a release film for laser attenuation laminated on the resin insulation layer, wherein the thickness of the release film for laser attenuation is By setting it to more than 50 μm and 180 μm or less, it becomes possible to form a via hole having a top diameter of 30 μm or less and a difference between the top diameter and the bottom diameter of 10 μm or less. |
| priorityDate |
2014-06-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |