| abstract |
An object of the present invention is to provide an aluminum-diamond-based composite that has high thermal conductivity and a thermal expansion coefficient close to that of a semiconductor element, and can suppress the occurrence of swelling of the surface metal layer portion even in actual use under a high load. . The first peak of the volume distribution of the particle diameter is 5 to 25 μm, the second peak is 55 to 195 μm, the area of the volume distribution having a particle diameter of 1 to 35 μm and the volume distribution of 45 to 205 μm. The ratio of the area is 1 to 9 to 4 to 6, and the diamond powder having a circularity of 0.94 or more is contained in 65 vol% to 80 vol%, and the balance is made of a metal containing aluminum. A featured aluminum-diamond composite is provided. |