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filingDate 2015-03-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2015151935-A1
titleOfInvention Copper foil with carrier foil, copper-clad laminate and printed wiring board manufacturing method
abstract An object of the present invention is to provide a copper foil with a carrier foil suitable for the production of a copper clad laminate used for laser drilling. To achieve this object, a copper foil with a carrier foil having a layer structure of carrier foil / peeling layer / bulk copper layer, the maximum length of the copper composite compound on both surfaces of the copper foil with a carrier foil is 500 nm. Provided with a roughening treatment layer having a fine uneven structure formed by the following needle-like or plate-like convex portions, the roughening treatment layer provided on the surface of the carrier foil is used as a laser light absorption layer, The roughening layer provided on the surface of the bulk copper layer is used as an adhesive layer with the insulating layer constituting material, and provides a copper foil with a carrier foil.
priorityDate 2014-03-31-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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