http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015141769-A1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-072 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0709 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0154 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-108 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-38 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-092 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
filingDate | 2015-03-19-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2017-04-13-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2015141769-A1 |
titleOfInvention | Printed wiring board substrate, printed wiring board, and printed wiring board manufacturing method |
abstract | A base film having insulating properties, a first conductive layer laminated on at least one surface of the base film by application of conductive ink containing metal particles, and a surface of the first conductive layer opposite to the base film by plating. A printed wiring board substrate comprising a second conductive layer to be laminated, wherein a metal oxide species based on the metal of the metal particles and a metal based on the metal of the metal particles are provided in the vicinity of the interface between the base film and the first conductive layer. There is a hydroxide species, and the mass per unit area of the metal oxide species in the vicinity of the interface between the base film and the first conductive layer is 0.1 μg / cm 2 or more and 10 μg / cm 2 or less, relative to the metal hydroxide species of the metal oxide species The mass ratio is 0.1 or more. |
priorityDate | 2014-03-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 44.