| abstract |
(A) a liquid epoxy resin containing no siloxane bond in the molecule, (B) an acid anhydride curing agent, (C) A spherical inorganic filler having an average particle diameter of 0.1 to 10 μm measured by a laser diffraction method as an inorganic filler, the surface of which is made of a (meth) acryl functional silane coupling agent, and is spherical as a component (C) A surface-treated spherical inorganic filler that has been surface-treated at a ratio of 0.5 to 2.0 parts by mass with respect to 100 parts by mass of the inorganic filler, (D) It relates to a liquid epoxy resin composition for encapsulating a semiconductor containing a curing accelerator, and according to the present invention, a semiconductor device having excellent heat resistance and moisture resistance can be provided. |