| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-51
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2264-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0353
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B15-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-245 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B27-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 |
| filingDate |
2014-10-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-03-16-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2015072261-A1 |
| titleOfInvention |
Carrier material with resin layer, laminate, circuit board and electronic device |
| abstract |
A carrier material (1) with a resin layer for a circuit board includes a carrier material (12) and a resin layer (11) provided on one surface of the carrier material (12). The resin layer (11) contains a thermosetting resin and is in a B stage state. Further, the storage elastic modulus E ′ LT at −40 ° C. of the cured product (C stage state) of the resin layer (11) is 0.1 GPa or more and 3.5 GPa or less. This cured product is obtained by heating the resin layer (11) at 190 ° C. for 2 hours. |
| priorityDate |
2013-11-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |