http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015053132-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2457-20 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68386 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6834 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68327 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B2307-306 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J179-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B32B27-08 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02 |
| filingDate | 2014-09-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-03-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2015053132-A1 |
| titleOfInvention | LAMINATE FOR ELEMENT PROCESSING, METHOD FOR PRODUCING LAMINATE FOR ELEMENT PROCESSING, AND METHOD FOR PRODUCING THIN ELEMENT USING THE SAME |
| abstract | There is no generation of volatile components in the backside polishing and backside circuit forming process of a semiconductor circuit forming substrate, and there is no occurrence of cracking of the substrate due to peeling, and the semiconductor circuit after peeling is possible under mild conditions at room temperature. Provided is an element processing laminate in which almost no temporary adhesive remains on the formation substrate side. In an element processing laminate in which an element processing substrate is stacked on a support substrate via a temporary adhesive layer, the temporary adhesive layer is stacked in the order of the heat resistant resin layer A and the heat resistant resin layer B from the support substrate side. The adhesive strength between the heat resistant resin layer B and the element processing substrate is lower than the adhesive strength between the heat resistant resin layer A and the support substrate and the adhesive strength between the heat resistant resin layer B and the heat resistant resin layer A. The laminated body for element processing characterized. [Selection] Figure 1 |
| priorityDate | 2013-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 252.