| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C2222-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D3-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-12 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-52
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-83
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C22-63
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-0614
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-384
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-611
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-627
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-617
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-48 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C28-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D1-04 |
| filingDate |
2014-08-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2017-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2015040998-A1 |
| titleOfInvention |
Copper foil, copper foil with carrier foil and copper clad laminate |
| abstract |
An object of the present invention is to provide a copper foil having good adhesion to an insulating resin base material and having good etching performance equivalent to that of a non-roughened copper foil as compared with a non-roughened copper foil. In order to achieve this object, a copper foil provided with a roughening treatment layer on at least one surface of the copper foil, the roughening treatment layer having a needle-like or plate-like shape having a size of 500 nm or less made of a copper composite compound. A copper foil having a fine concavo-convex structure formed from convex portions and having a silane coupling agent treatment layer provided on the surface of the roughening treatment layer is employed. Or, on the surface of the copper foil layer of the copper foil with carrier foil having a layer configuration of carrier foil / bonding interface layer / copper foil layer, from a needle-like or plate-like convex part having a size of 500 nm or less made of a copper composite compound A copper foil with a carrier foil, which is provided with a roughening treatment layer having a fine concavo-convex structure formed and provided with a silane coupling agent treatment layer on the surface of the roughening treatment layer, is employed. |
| priorityDate |
2013-09-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |