http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015033834-A1
Outgoing Links
Predicate | Object |
---|---|
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L71-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-00 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L71-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 |
filingDate | 2014-08-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate | 2017-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | JP-WO2015033834-A1 |
titleOfInvention | Curable composition and connection structure |
abstract | Provided is a curable composition using a phenoxy resin capable of obtaining a curable composition that gives a cured product having high adhesion under high temperature and high humidity. The curable composition concerning this invention contains the phenoxy resin which has a hydrolysable group in a side chain, and electroconductive particle. |
priorityDate | 2013-09-05-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 146.