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filingDate 2014-06-11-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2015025592-A1
titleOfInvention Manufacturing method of resin molding
abstract The method for producing a resin molded product of the present invention is characterized in that a curable resin composition containing an organosilicon compound is molded and cured using a molding die surface-treated with a baking mold release agent containing silicone. . The organosilicon compound used in the resin molded product of the present invention can be at least one selected from the group consisting of an organosilane compound, an organic modified siloxane compound, and a silicon modified acrylic compound. ADVANTAGE OF THE INVENTION According to this invention, the manufacturing method of the resin molding which is excellent in the adhesion prevention effect of a scale and the removal effect of a scale over a long period of time can be provided.
priorityDate 2013-08-22-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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