http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2015012381-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G59-42 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-20 |
| filingDate | 2014-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2017-03-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2015012381-A1 |
| titleOfInvention | Thermosetting resin composition, cured film, substrate with cured film, and electronic component |
| abstract | The present invention relates to a thermosetting resin composition, a cured film, a substrate with a cured film, and an electronic component, and the thermosetting resin composition has the formulas (i-1) to (i-2) and (ii-1). -One or more types of carboxyl group-containing compounds (A) selected from the group consisting of compounds represented by (ii-4) and an epoxy compound (B) having a fluorene skeleton are included. |
| priorityDate | 2013-07-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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