Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-022 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L61-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0366 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-293 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D307-92 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G8-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07D307-77 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-09 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0326 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0373 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L63-04 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G59-62 |
filingDate |
2014-02-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2017-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-WO2014208132-A1 |
titleOfInvention |
Phenolic hydroxyl group-containing compound, phenol resin, curable composition, cured product thereof, semiconductor sealing material, and printed wiring board |
abstract |
Provided are a phenolic hydroxyl group-containing compound excellent in heat resistance and flame retardancy in a cured product, a phenol resin containing the compound, a curable composition and a cured product thereof, and a semiconductor sealing material. A phenolic hydroxyl group-containing compound having a dinaphthofuran skeleton, each of which has a hydroxyl group on its aromatic nucleus. |
priorityDate |
2013-06-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |