abstract |
To provide a phenolic hydroxyl group-containing compound excellent in heat resistance and flame retardancy in a cured product, a phenol resin containing the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed wiring board. The following structural formula (I) [Wherein j and k are each 1 or 2, and at least one of j and k is 2. ] A dinuclear compound (X) represented by the following structural formula (II) [Wherein, l, m and n are each 1 or 2, and at least one of l, m and n is 2. ] And a trinuclear compound (Y) represented by the formula: |