| abstract |
A resin composition used as a material for the insulating layer of a printed wiring board comprising an insulating layer and a conductor layer formed on the surface of the insulating layer by plating, the epoxy compound (A), a cyanate ester A compound (B), a maleimide compound (C), an inorganic filler (D), and an imidazole silane (E), wherein the maleimide compound (C) includes a predetermined maleimide compound, and the maleimide compound (C) is contained. The amount is 25% by mass or less with respect to 100% by mass of the total content of the epoxy compound (A), the cyanate ester compound (B), and the maleimide compound (C), and the imidazole silane ( The resin composition in which E) contains the compound represented by following formula (3). |