abstract |
INDUSTRIAL APPLICABILITY The present invention can provide a photocurable epoxy adhesive that is excellent in polymerization conversion at low temperature, has excellent adhesive strength and moisture permeability, and gives a cured product having good productivity. The photocurable epoxy adhesive of the present invention comprises (A) an epoxy monomer or oligomer; (B) a photocationic polymerization initiator; and (C) a layered silicate. Since the adhesive is photocurable, it can be cured at a low temperature and exhibits excellent adhesive strength. Moreover, since it can be cured in a short time, it is excellent in productivity. The cured resin composition has high moisture permeability resistance. |