http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014119301-A1

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K3-1463
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-02
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-304
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B24B37-00
filingDate 2014-01-29-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2017-01-26-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2014119301-A1
titleOfInvention Surface selective polishing composition
abstract The present invention provides a polishing composition that exhibits a high polishing rate ratio of a silicon nitride (SiN) surface to a silicon oxide surface and / or a SiN surface to a polycrystalline silicon (polysilicon) surface. In some embodiments, the polishing composition of the present invention comprises colloidal silica and one or more water soluble polymers and has a pH of 6 or less. Colloidal silica contains one or more organic acids bonded to its surface, and the water-soluble polymer is a polyoxyalkylene hydrocarbyl ether whose hydrocarbyl group has 12 or more carbon atoms.
priorityDate 2013-02-01-04:00^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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