| abstract |
The surface of the power semiconductor chip mounted in the power semiconductor module that does not face the wiring thin film and the surface of the bonding wire are sealed with a sealing resin A that does not contain a heat conductive filler, and the sealing resin A Is sealed with a sealing resin B containing a thermally conductive filler, so that both the cooling performance and long-term reliability of the power semiconductor module can be achieved. |