Predicate |
Object |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0061 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B32B15-08 |
filingDate |
2013-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationDate |
2016-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
JP-WO2014054811-A1 |
titleOfInvention |
Multilayer printed wiring board manufacturing method and base substrate |
abstract |
A method for manufacturing a multilayer printed wiring board includes a first step of preparing a base substrate in which a resin layer is laminated on at least one main surface of a metal plate carrier via a release agent layer, And a second step of laminating one or more buildup layers on the resin layer. The substrate thickness of the plate carrier is preferably 5 μm or more and 1600 μm or less. The peel strength between the plate-like carrier and the resin layer is preferably 10 gf / cm or more and 200 gf / cm or less. |
priorityDate |
2012-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |