http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014054803-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1366 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0097 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4682 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49822 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-49894 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46 |
| filingDate | 2013-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-08-25-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2014054803-A1 |
| titleOfInvention | Multilayer printed wiring board manufacturing method and base substrate |
| abstract | A method of manufacturing a base substrate for manufacturing a multilayer printed wiring board includes a step of preparing a resin plate carrier, and a laminate in which a release agent layer is laminated on a metal foil. A release agent layer is laminated on a metal foil laminated on a main surface or previously laminated on at least one main surface of the plate carrier, and the metal foil is formed on the main surface of the plate carrier. And laminating the release agent layer. |
| priorityDate | 2012-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 345.