http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2014017323-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1225 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09D11-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-1292 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D11-02 |
| filingDate | 2013-07-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2016-07-11-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2014017323-A1 |
| titleOfInvention | Conductive ink for reverse printing, method for manufacturing thin film transistor, and thin film transistor formed by the method |
| abstract | Provided is a conductive ink for letterpress reversal printing having a wider allowable time range in which a pattern formed on a blanket can be fully transferred to a support. A liquid composed of an organic solvent in which conductive particles having a volume average particle diameter (Mv) of 2 to 250 nm contain a fluorine-based surface energy adjusting agent and / or a silicone-based surface energy adjusting agent and water as an essential component. A conductive ink for letterpress reversal printing for forming a conductive pattern by interparticle fusion bonding of the conductive particles, wherein the conductive ink is dispersed on a support, the conductive ink being dispersed in a medium. A method of manufacturing a thin film transistor, comprising: forming a coating film pattern by a letterpress reverse printing method; and then forming a conductive pattern by melting and bonding conductive particles in the coating film pattern between the particles, and the thin film transistor . |
| priorityDate | 2012-07-26-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 88.