| abstract |
In mounting a semiconductor element on a substrate, it becomes easy to grasp the remaining amount of the bonding aid, stabilize the supply amount of the bonding aid, and prevent the shortage of the bonding aid. In addition, to enable efficient maintenance of the mounting equipment, assisting the joining of metals, which is adjusted by dissolving the colorant in a reducing solvent that has the effect of removing the metal surface oxide film. Use a bonding aid. The bonding aid is obtained by a production method having a step of mixing a reducing solvent having an action of removing a metal surface oxide film and a colorant having solubility in the solvent. |