| abstract |
The electronic component (2) having the main surface on which the first electrode (12) is formed is turned into the circuit member (1) having the main surface on which the second electrode (11) corresponding to the first electrode (12) is formed. Mounting the bonding material (3) containing the thermosetting resin and the solder (13) between the first electrode and the second electrode, and mounting the electronic component (2) on the circuit member (1) The thermosetting resin is first heated and cured at a temperature lower than the melting point of the solder while pressing, and then the step of releasing the pressure of the pressure, the first electrode (with the pressure of the pressure released) 12) and the second electrode (11) are secondly heated and melted to electrically connect the first electrode (12) and the second electrode (11). Electronic component mounting method. |