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filingDate 2013-03-25-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-12-14-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2013146713-A1
titleOfInvention Method for producing silicon nitride powder, silicon nitride powder, silicon nitride sintered body, and circuit board using the same
abstract An object of the present invention is to provide a silicon nitride sintered body having high mechanical strength and thermal conductivity and a circuit board using the same. When a specific surface area is RS (m 2 / g) and an oxygen content ratio is RO (mass%), an amorphous Si—N (—H) compound having an RS / RO of 500 or more is flowed in a continuous firing furnace. In the temperature range of 1000 to 1400 ° C., heating is performed at a rate of temperature increase of 12 to 100 ° C./min. In addition, the content ratio of oxygen existing from the particle surface to 3 nm immediately below the particle surface is FSO (mass%), the oxygen content ratio present from 3 nm directly below the particle surface to FIO (mass%), and the specific surface area is FS. (M 2 / g), FS / FSO is 8 to 25, FS / FIO is 22 or more, silicon nitride powder, and nitriding obtained by sintering the silicon nitride powder A silicon sintered body and a circuit board using the silicon nitride sintered body are provided.
priorityDate 2012-03-28-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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