| abstract |
A photosensitive resin composition that exhibits positive or negative photosensitivity and is used as a mask in an ion implantation process, and contains (A) polysiloxane as a resin. The photosensitive resin composition of the present invention has high heat resistance, can control the pattern shape, has excellent ion implantation mask performance, and can be applied to a low-cost high-temperature ion implantation process. |