| abstract |
Provided are a curable composition that provides a cured film having a low dielectric constant, low water absorption, and laser processing, a laser processing method for the cured film, and a method for producing a multilayer wiring structure. A curable composition containing a fluorine-containing polyarylene prepolymer (A) having a crosslinkable functional group, a laser for irradiating a cured film obtained by curing the composition with laser light to remove a part of the cured film A manufacturing method of a multilayer wiring structure including a step of forming a via hole in an insulating film made of the cured film by the processing method and the processing method. |