http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013065714-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C43-003 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-346 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-7671 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-345 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1035 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-14 |
| filingDate | 2012-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-04-02-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2013065714-A1 |
| titleOfInvention | Polyamideimide resin composition for compression molding |
| abstract | Polyamideimide resin is a material excellent in heat resistance, mechanical strength, electrical properties, and chemical resistance, but has poor melt moldability, and in particular, polyamideimide resin obtained from an isocyanate polymerization method is subjected to high temperature thermoforming. Gelled and could not be molded. Polyamideimide obtained by a specific logarithmic viscosity with a polyamideimide resin skeleton having a rigid component introduced in the molecular structure of the polyamideimide resin and a toughness, blocking the isocyanate functional group at the end of the polyamideimide molecule and suppressing the polymerization reaction. A polyamide-imide resin composition for compression molding that enables compression molding by making the resin into a powder. [Selection figure] None |
| priorityDate | 2011-10-31-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 41.