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filingDate 2012-10-12-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2013054883-A1
titleOfInvention Abrasive slurry and polishing method
abstract The present invention provides an abrasive slurry capable of polishing high hardness materials such as silicon carbide and gallium nitride at a high polishing rate. The present invention is an abrasive slurry for polishing a high-hardness material having a Mohs hardness of 8 or more, comprising a slurry containing manganese oxide particles and manganate ions. In the present invention, the manganese oxide particles in the slurry are preferably 1.0% by mass or more, the manganese oxide is preferably manganese dioxide, and the manganate ion is preferably a permanganate ion. According to the abrasive slurry of the present invention, it is possible to perform smooth polishing at a high speed even on hard-to-cut materials such as silicon carbide and gallium nitride.
priorityDate 2011-10-13-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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