| Predicate |
Object |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-5425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-0001
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-20
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L33-48 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-296
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C45-14655
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-07
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L83-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L33-48
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-098
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J3-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K9-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-5425
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29 |
| filingDate |
2012-10-03-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate |
2015-03-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
JP-WO2013051600-A1 |
| titleOfInvention |
Curable resin composition, curable resin composition tablet, molded product, semiconductor package, semiconductor component, and light emitting diode |
| abstract |
An object of this invention is to provide the curable composition which has a low linear expansion coefficient and gives a tough hardened | cured material. The curable resin composition of the present invention includes (A) a silicon compound having a molecular weight of less than 1000 and containing at least two carbon-carbon double bonds having reactivity with SiH groups in one molecule, and (B) in one molecule. A compound containing at least two SiH groups, (C) a hydrosilylation catalyst, (D) at least one carbon-carbon double bond having reactivity with SiH groups in one molecule, and having a molecular weight of 1000 It contains the above silicone compound and (E) inorganic filler as essential components. |
| priorityDate |
2011-10-04-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |