| abstract |
For example, when used as a solder paste, the first metal and the second metal in the soldering process have good diffusibility, and an intermetallic compound having a high melting point is produced at a low temperature in a short time. There are provided a conductive material that does not remain and has excellent heat resistance strength, and a connection method and a connection structure that use the conductive material and have high connection reliability. A metal component comprising a first metal and a second metal having a higher melting point, wherein the first metal is Sn or an alloy containing Sn, and the second metal is at least 310 ° C. with the first metal. It is set as the requirement provided that it is a Cu-Al alloy which produces | generates the intermetallic compound which shows melting | fusing point of. As the first metal, Sn alone, or Cu, Ni, Ag, Au, Sb, Zn, Bi, In, Ge, Al, Co, Mn, Fe, Cr, Mg, Mn, Pd, Si, Sr, Te, An alloy containing at least one kind of P and Sn can be used. |