http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2013002283-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-18 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23F1-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0337 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K13-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0041 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-004 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32134 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-308 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09K13-06 |
| filingDate | 2012-06-27-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2015-02-23-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2013002283-A1 |
| titleOfInvention | Etching solution and etching method using the same |
| abstract | Etching solution for copper oxide that can selectively etch exposed and unexposed areas when exposed to laser light using copper oxide as a thermally reactive resist material, and control of the etching rate, and An etching method using this is provided. The etching solution of the present invention is a copper oxide etching solution for selectively removing copper oxide having a specific valence from a copper oxide-containing layer containing copper oxides having different valences, and at least an amino acid and a chelating agent And water, the amino acid weight ratio is higher than that of the chelating agent, and the pH is 3.5 or more. |
| priorityDate | 2011-06-30-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 122.