| abstract |
The semiconductor device (A1) includes a semiconductor element (2) having a plurality of electrodes (21), a plurality of terminals (3) electrically connected to the plurality of electrodes (21), and a sealing resin ( 1). The sealing resin (1) covers the plurality of terminals (3) so as to expose the bottom surface (3a) in the thickness direction (z) of the semiconductor element (2). A certain 1st terminal (3) is arrange | positioned in the position which overlaps with the 1st electrode (21) which is either of several electrodes (21) in thickness direction (z) view. The semiconductor device (A1) includes a conductive connection member (4) in contact with both the first terminal (3) and the first electrode (21). |