http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012098734-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L69-00 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J5-18 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-69 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L75-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L79-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-44 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-4854 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1046 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-106 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G18-60 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G18-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 |
| filingDate | 2011-09-21-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2012098734-A1 |
| titleOfInvention | Resin composition, cured product, resin film and wiring board |
| abstract | Resin composition and resin composition that can reduce warpage during curing, has excellent heat resistance, and can be suitably used as a material for semiconductor device surface protective film, interlayer insulating film, printed wiring board protective insulating film, interlayer insulating film, etc. To provide a resin film using objects and a wiring board using them. The resin composition of the present invention comprises (A) a polymer compound, (B) a polyfunctional hydroxyl group-containing compound having two or more hydroxyl groups, and (C) the polymer compound and / or the polyfunctional hydroxyl group-containing compound. A polyfunctional crosslinkable compound having two or more crosslinkable functional groups that form a crosslink between them, wherein the polyfunctional crosslinkable compound is the polymer compound and / or the polyfunctional hydroxyl group-containing compound. It is characterized in that a three-dimensional bridge can be formed between them. |
| priorityDate | 2011-01-18-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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