| abstract |
A resin composition containing a polyether polyamide elastomer, which preferably adheres firmly to a polyimide resin, preferably in a simple process to form an interface, preferably an adhesive composition, and this resin composition It is an object of the present invention to provide an adhesive complex in which an epoxy resin and a polyimide resin are bonded to form an interface. A resin composition for forming and bonding an interface with a polyimide resin, The resin composition includes a polyether polyamide elastomer (component R) obtained by polymerizing a specific aminocarboxylic acid compound A1 and / or a lactam compound A2, a polyether compound B, and a dicarboxylic acid compound C, The resin composition whose content of the said component R is 80 to 100 weight%. |