http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012095907-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-13 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-73 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0133 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0132 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-13111 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-32 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-585 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3192 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-522 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-3205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-60 |
| filingDate | 2011-10-20-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-06-09-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2012095907-A1 |
| titleOfInvention | Semiconductor device and flip chip mounting product |
| abstract | The semiconductor device 50 includes a substrate 1 having a circuit forming region 2, an interlayer insulating film 11 formed on the substrate 1, a first seal ring 4 formed in the interlayer insulating film 11 and surrounding the circuit forming region 2, A first protective film 6 formed in a circuit formation region on the interlayer insulating film 11 and a region including the upper part of the first seal ring 4, and formed on the first protective film 6 and inside the first seal ring 4. A second protective film 7. The first protective film 6 includes a first surface that contacts the second protective film 7, a second surface that is located immediately above the first seal ring 4, and a first surface that leads from the first surface to the second surface. 3 surfaces. The end portion of the second protective film 7 is located inside the third surface. |
| priorityDate | 2011-01-14-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 29.