http://rdf.ncbi.nlm.nih.gov/pubchem/patent/JP-WO2012060284-A1
Outgoing Links
| Predicate | Object |
|---|---|
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-24 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D7-12 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B13-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D201-00 |
| filingDate | 2011-10-28-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationDate | 2014-05-12-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | JP-WO2012060284-A1 |
| titleOfInvention | Low-temperature sinterable conductive paste, conductive film using the same, and method for forming conductive film |
| abstract | If a substrate having low heat resistance is to be used, heat treatment at around 120 ° C. where deformation or the like does not occur is desired. In addition, if the resistance can be reduced regardless of the type of resin used for the conductive paste, the paste can be designed according to the purpose, and the field of application is widened. Therefore, it is possible to form a conductive film that exhibits high conductivity even at a low temperature of about 120 ° C., regardless of whether the resin that is configured is thermosetting or thermoplastic. To provide a conductive paste. A method for forming a conductive film, wherein a dicarboxylic acid having 2 to 8 carbon atoms is added to a paste composed of silver nanoparticles coated with an organic substance having 2 to 6 carbon atoms, a dispersion medium, and a resin. The paste is used as a wiring formation paste. |
| priorityDate | 2010-11-01-04:00^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
Total number of triples: 111.