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filingDate 2011-10-06-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationDate 2014-02-24-04:00^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber JP-WO2012046807-A1
titleOfInvention Surface conductive multilayer sheet
abstract In the present invention, a surface conductive thermoplastic resin sheet in which defects relating to fluff and burrs are suppressed for any molding machine by a slitting method or punching during emboss molding, and an emboss carrier using the sheet A molded body such as a tape is provided. Each layer is composed of a thermoplastic resin A or a resin composition mainly composed of the thermoplastic resin A having an average thickness of 2 to 50 μm, and includes a multilayer in which 10 to 50 layers of the individual layers are laminated. Conductive resin layer comprising 65 to 95% by mass of a resin composition mainly composed of thermoplastic resin B or thermoplastic resin B and 5 to 35% by mass of carbon black on one or both surfaces of the resulting base sheet. And an electronic component package comprising the conductive multilayer sheet, a carrier tape, and a tray are provided.
priorityDate 2010-10-07-04:00^^<http://www.w3.org/2001/XMLSchema#date>
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