| abstract |
Provided are conductive particles that are difficult to cause large cracks in a conductive layer even when a large force is applied to the conductive particles, and an anisotropic conductive material and a connection structure using the conductive particles. The conductive particle 1 according to the present invention includes a base particle 2 and a copper-tin layer 3 provided on the surface 2 a of the base particle 2. The copper-tin layer 3 contains an alloy of copper and tin. The copper content in the entire copper-tin layer 3 is more than 20% by weight and 75% by weight or less, and the tin content is 25% by weight or more and less than 80% by weight. The anisotropic conductive material according to the present invention includes conductive particles 1 and a binder resin. The connection structure according to the present invention includes a first connection target member, a second connection target member, and a connection portion that connects the first and second connection target members. The connecting portion is formed of the conductive particles 1 or an anisotropic conductive material including the conductive particles 1. |